Dispensing Pin glue the electronic component solder or adhesive in precision position. The adhesivemust be placed in an appropriate amount at each attachment position while avoiding excessive solder paste on the PCBor IC.This is a high-speed precisionrepeatability process.

Application: 
• ASM Bonding Machine
• IC
• Assembly
• LED
Features/Benefits:
• Saving consumables
• High mobility
• High and low viscosity glue corresponding
• Precise and labor saving
• Material: Black Zirconia