Dispensing Pin glue the electronic component solder or adhesive in precision position. The adhesive must be placed in an appropriate amount at each attachment position while avoiding excessive solder paste on the PCB or IC. This is a high-speed precision repeatability process.
Application: 
• ASM Bonding Machine
• IC
• Assembly
• LED
Features/Benefits:
• Saving consumables
• High mobility
• High and low viscosity glue corresponding
• Precise and labor saving
• Material: Steel