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Porous Ceramic(PC)
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Porous Ceramic/PC

     Microporous ceramics typically have a porosity of 30 to 40 percent, making them effective at blocking bacteria and suspended solids. The compressive strength is 90 MPa, the flexural strength is 53 MPa, and the thermal conductivity at room temperature is between 0.23~0.40 W/(m·K), depending on the content of the catalyst Ni(NO3)2·6H2O.
Microporous ceramic data: This microporous ceramic has a density of 2.02 g/cm³, a sintering shrinkage rate of 20.34%, and an apparent porosity of 34.74%. The specific heat and C are 2.02 J/㎏·K, and the thermal conductivity coefficient is between 0.23~0.40 W/m·K.
     Microporous ceramic material properties: Microporous ceramics prepared from it have a porosity of 63% to 82% and a compressive strength of 0.72~1.89 MPa. When the sintering temperature reaches 1350°C, the mechanical strength of microporous ceramics reaches its maximum value, with a compressive strength of 90 MPa and a flexural strength of 53 MPa.
      Microporous ceramic is a high-tech ceramic material with special properties. It has the advantages of light weight, high strength, good heat resistance, excellent insulation, etc.
. The following are some common microporous ceramic performance data:

Physical properties
Specific gravity (S.G): usually between 0.5~1.5 g/cm3
Porosity: 30%~80%
Vickers hardness (HV1 Hardness): 300~800 HV
Flexural Strength: 20~100 MPa
Compressive Strength: 50~300 MPa
Young's Modulus: 10~100 GPa
Fracture Toughness: 1~5 MPam^1/2^

Thermal properties
Linear thermal expansion coefficient (40~400°C): approximately 10 x 10^-6^/°C
Linear thermal expansion coefficient (40~800°C): approximately 10.5 x 10^-6^/°C
Thermal Conductivity: 0.1~2 W/m-K
Specific Heat: 700~1100 J/kg*°K

Electrical properties
Dielectric Strength: 10~20 KV/mm
Volume resistivity (20°C): >10^12^ Ω.cm
Volume resistivity (500°C): >10^8^ Ω.cm
Dielectric constant (1MHz): 4~10 C^2^/(N*m^2^)
Dielectric loss angle (1MHz): <10 x 10^-4^
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